WO2026120355 - HYPOCHLOROUS ACID-CONTAINING COMPOSITION FOR TREATING ONYCHOMYCOSIS
National phase entry is expected:
Publication Number
WO/2026/120355
Publication Date
11.06.2026
International Application No.
PCT/IB2025/059398
International Filing Date
19.09.2025
Title **
[English]
HYPOCHLOROUS ACID-CONTAINING COMPOSITION FOR TREATING ONYCHOMYCOSIS
[French]
COMPOSITION CONTENANT DE L'ACIDE HYPOCHLOREUX POUR LE TRAITEMENT D'ONYCHOMYCOSE
[Chinese]
用于处理甲癣的包含次氯酸的合成物
Applicants **
JACOBSON VAN DEN BERG (CHINA) LIMITED
Inventors
LAM, Kwok Ming
Priority Data
32024100539.8
06.12.2024
HK
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
CNIPA
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1575 | |
| EPO | Filing, Examination, Granting | 11598 | |
| Japan | Filing, Examination, Granting | 1921 | |
| South Korea | Filing, Examination, Granting | 1598 | |
| USA | Filing, Examination, Granting | 4740 |

Total:
21,432
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Abstract[English]
A hypochlorous acid-containing composition for treating onychomycosis, comprising: about 1-50,000 ppm of hypochlorous acid, a pH-adjusting agent for adjusting the pH of the composition to 2 to 9, and water. Preferably, the composition comprises 100-200 ppm of hypochlorous acid. Preferably, the composition comprises 240 ppm or less of the pH-adjusting agent. Preferably, the pH-adjusting agent adjusts the pH of the composition to 5 to 6.5. Preferably, the pH-adjusting agent comprises one of sodium carbonate, sodium bicarbonate, and calcium hydroxide. Hypochlorous acid can inhibit or kill Trichophyton rubrum, Candida albicans, Fusarium, Aspergillus, Acremonium, Scytalidium, Scopulariopsis brevicaulis, and other fungal strains and spores thereof that involve a potential risk of onychomycosis, thereby effectively treating fungi, spores, and other pathogens that cause onychomycosis.[French]
L'invention concerne une composition contenant de l'acide hypochloreux pour le traitement d'onychomycose, comprenant : environ 1 à 50 000 ppm d'acide hypochloreux, un agent d'ajustement du pH pour ajuster le pH de la composition entre 2 et 9, et de l'eau. De préférence, la composition comprend 100 à 200 ppm d'acide hypochloreux. De préférence, la composition comprend 240 ppm ou moins de l'agent d'ajustement du pH. De préférence, l'agent d'ajustement du pH ajuste le pH de la composition entre 5 et 6,5. De préférence, l'agent d'ajustement du pH comprend l'un parmi du carbonate de sodium, du bicarbonate de sodium et de l'hydroxyde de calcium. L'acide hypochloreux peut inhiber ou tuer le Trichophyton rubrum, Candida albicans, Fusarium, Aspergillus, Acremonium, Scytalidium, Scopulariopsis brevicaulis, et d'autres souches fongiques et des spores de ceux-ci qui impliquent un risque potentiel d'onychomycose, ce qui permet de traiter efficacement des champignons, des spores et d'autres pathogènes qui provoquent une onychomycose.[Chinese]
一种用于处理甲癣的包含次氯酸的合成物,包括:约1至50,000ppm的次氯酸;pH调整剂以调整合成物的pH到2至9;以及水。优选地,合成物包括100至200ppm的次氯酸。优选地,合成物包括240ppm以下的pH调整剂。优选地,pH调整剂调整合成物的pH到5至6.5。优选地,pH调整剂包括碳酸钠、碳酸氢钠和氢氧化钙的其中一种。该次氯酸可抑制或杀死红色毛癣菌,白色念珠菌,镰孢菌属,曲霉属,枝顶孢霉属,柱顶孢霉属,和短柄帚霉及其他有潜在风险引致灰甲的真菌菌株和其孢子,因此有效处理灰指甲内的真菌及孢子和其他引致灰甲的病菌。