WO2025224645 - METHOD FOR JOINING DIAMONDS
National phase entry is expected:
Publication Number
WO/2025/224645
Publication Date
30.10.2025
International Application No.
PCT/IB2025/054229
International Filing Date
23.04.2025
Title **
[English]
METHOD FOR JOINING DIAMONDS
[French]
PROCÉDÉ D'ASSEMBLAGE DE DIAMANTS
Applicants **
MEHTA, Mitul
Inventors
MEHTA, Mitul
Priority Data
24172336.0
25.04.2024
EP
24172356.8
25.04.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Natural Person
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2778 | |
| EPO | Filing, Examination, Granting | 15053 | |
| Japan | Filing, Examination, Granting | 2956 | |
| South Korea | Filing, Examination, Granting | 3523 | |
| USA | Filing, Examination, Granting | 8540 |
Total:
32,850
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Abstract[English]
A method of joining diamonds together is disclosed. The method includes placing two or more diamond pieces together, each diamond piece having at least one mating surface. The two or more diamonds are placed such that the mating surface of one diamond piece is in contact with the mating surface of at least one other diamond piece. The two or more diamonds are joined together by welding along their mating surfaces by a laser source selected from a group consisting of a femtosecond laser, a picosecond laser, or a combination thereof. A diamond material comprising two or more diamond pieces joined together by said method is also disclosed.[French]
L'invention concerne un procédé d'assemblage de diamants. Le procédé consiste à placer ensemble au moins deux morceaux de diamant, chaque morceau de diamant comportant au moins une surface de contact. Lesdits diamants sont placés de telle sorte que la surface de contact d'un morceau de diamant est en contact avec la surface de contact d'au moins un autre morceau de diamant. Lesdits diamants sont assemblés par soudage le long de leurs surfaces de contact au moyen d'une source laser choisie dans un groupe constitué d'un laser femtoseconde, d'un laser picoseconde, ou d'une combinaison de ceux-ci. L'invention concerne également un matériau de diamant comprenant au moins deux morceaux de diamant assemblés au moyen dudit procédé.