WO2025224644 - HERMETICALLY SEALED COVER FOR AN ELECTRONIC DEVICE
National phase entry is expected:
Publication Number
WO/2025/224644
Publication Date
30.10.2025
International Application No.
PCT/IB2025/054228
International Filing Date
23.04.2025
Title **
[English]
HERMETICALLY SEALED COVER FOR AN ELECTRONIC DEVICE
[French]
COUVERCLE FERMÉ HERMÉTIQUEMENT POUR DISPOSITIF ÉLECTRONIQUE
Applicants **
MEHTA, Mitul
Inventors
MEHTA, Mitul
Priority Data
24172336.0
25.04.2024
EP
24172356.8
25.04.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Natural Person
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2526 | |
| EPO | Filing, Examination, Granting | 10454 | |
| Japan | Filing, Examination, Granting | 2514 | |
| South Korea | Filing, Examination, Granting | 2742 | |
| USA | Filing, Examination, Granting | 5940 |
Total:
24,176
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Abstract[English]
A hermetically sealed cover for one or more electronic devices is disclosed. The hermetically sealed cover includes at least two or more encapsulating components made of diamond. Each encapsulating component includes a first surface, a second surface, and at least one mating surface. The first surface is configured to face towards the one or more electronic devices. The second surface is configured to face away from the one or more electronic devices. The at least one mating surface extends between the first surface and the second surface. The at least one mating surface of each encapsulating component is configured to be joined with at least one mating surface of the other encapsulating component via welding to hermetically enclose the one or more electronic devices between the at least two encapsulating components.[French]
L'invention concerne un couvercle fermé hermétiquement pour un ou plusieurs dispositifs électroniques. Le couvercle fermé hermétiquement comprend au moins deux composants d'encapsulation en diamant. Chaque composant d'encapsulation comprend une première surface, une seconde surface et au moins une surface de contact. La première surface est conçue pour faire face au ou aux dispositifs électroniques. La seconde surface est conçue pour être orientée à l'opposé du ou des dispositifs électroniques. Ladite surface de contact s'étend entre la première surface et la seconde surface. Ladite surface de contact de chaque composant d'encapsulation est conçue pour être jointe à au moins une surface de contact de l'autre composant d'encapsulation par soudage pour renfermer hermétiquement le ou les dispositifs électroniques entre lesdits composants d'encapsulation.