WO2025181707 - CONFINEMENT ROD-BASED SPOT SIZE CONVERTER FOR FIBER-TO-CHIP COUPLING IN PHOTONIC INTEGRATED CIRCUITS

National phase entry is expected:
Publication Number WO/2025/181707
Publication Date 04.09.2025
International Application No. PCT/IB2025/052083
International Filing Date 26.02.2025
Title **
[English] CONFINEMENT ROD-BASED SPOT SIZE CONVERTER FOR FIBER-TO-CHIP COUPLING IN PHOTONIC INTEGRATED CIRCUITS
[French] CONVERTISSEUR DE TAILLE DE POINT BASÉ SUR UNE TIGE DE CONFINEMENT POUR COUPLAGE FIBRE-PUCE DANS DES CIRCUITS INTÉGRÉS PHOTONIQUES
Applicants **
LUMIPHASE AG
Inventors
GRANDJEAN, Loris
ELTES, Felix
COMMIN, James Paul
Priority Data
63/558,421   27.02.2024   US
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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2139
EPO Filing, Examination, Granting10211
Japan Filing, Examination, Granting2296
South Korea Filing, Examination, Granting2298
USA Filing, Examination, Granting4740
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Abstract[English] A photonic device and method are disclosed for low-loss fiber-to-chip coupling in photonic integrated circuits. A waveguide tapers near the edge, reducing its width by at least 50%, while confinement rods arranged in multiple vertical layers above and below the waveguide taper in the opposite direction. Together, they form a complementary "super-mode," ensuring a smooth transition for the optical field. This design alleviates fabrication challenges tied to extremely narrow tapers and enables a smaller footprint than conventional edge couplers. By placing the waveguide at the super-mode's center, the dielectric stack is thinner, facilitating integration with standard silicon photonics processes. The result is a robust, compact, and highly efficient solution for fiber-to-chip interconnects.[French] Sont divulgués un dispositif photonique et un procédé de couplage fibre-puce à faible perte dans des circuits intégrés photoniques. Un guide d'ondes se rétrécit à proximité du bord, réduisant sa largeur d'au moins 50%, tandis que des tiges de confinement disposées dans de multiples couches verticales au-dessus et au-dessous du guide d'ondes se rétrécissent dans la direction opposée. Ils forment ensemble un "super-mode" complémentaire assurant une transition douce pour le champ optique. Cette conception atténue les défis de fabrication liés à des effilements extrêmement étroits et permet une empreinte plus petite que les coupleurs de bord classiques. En plaçant le guide d'ondes au centre du super-mode, l'empilement diélectrique est plus mince, facilitant l'intégration avec des processus photoniques de silicium standard. Le résultat est une solution robuste, compacte et hautement efficace pour des interconnexions fibre-puce.

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