WO2025177212 - MECHANICALLY COUPLING MULTIPLE WIRES TO IMPROVE ROBUSTNESS OF WIRE BOND INTERCONNECTIONS AGAINST MECHANICAL VIBRATIONS AND SHOCK
National phase entry is expected:
Publication Number
WO/2025/177212
Publication Date
28.08.2025
International Application No.
PCT/IB2025/051846
International Filing Date
20.02.2025
Title **
[English]
MECHANICALLY COUPLING MULTIPLE WIRES TO IMPROVE ROBUSTNESS OF WIRE BOND INTERCONNECTIONS AGAINST MECHANICAL VIBRATIONS AND SHOCK
[French]
COUPLAGE MÉCANIQUE DE MULTIPLES FILS POUR AMÉLIORER LA ROBUSTESSE D'INTERCONNEXIONS DE LIAISON FILAIRE FACE AUX VIBRATIONS MÉCANIQUES ET AU CHOC
Applicants **
BAKER HUGHES INTEQ GMBH
Inventors
LEWIN, Martin
REINKER, Johannes
JURK, Tobias
SCHWENGBER, Moritz
SCHNOEING, Christian
MOLDENHAUER, Karsten
Priority Data
63/556,150
21.02.2024
US
Application details
| Total Number of Claims/PCT | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2167 | |
| EPO | Filing, Examination, Granting | 10703 | |
| Japan | Filing, Examination, Granting | 2337 | |
| South Korea | Filing, Examination, Granting | 2350 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,297
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Abstract[English]
An electronics module and a method of manufacture. A first wire is bonded between a first conductive surface and a second conductive surface and proximate a second wire. The first wire has a first eigenfrequency. The first wire is mechanically coupled to the second wire via a coating to form a coating coupled wire. The coating coupled wire has a second eigenfrequency greater than the first eigenfrequency of the first wire.[French]
L'invention concerne un module électronique et un procédé de fabrication. Un premier fil est lié entre une première surface conductrice et une seconde surface conductrice et à proximité d'un second fil. Le premier fil présente une fréquence propre. Le premier fil est couplé mécaniquement au second fil par l'intermédiaire d'un revêtement pour former un fil couplé de revêtement. Le fil couplé à un revêtement présente une seconde fréquence propre supérieure à la première fréquence propre du premier fil.