WO2025177211 - COST-EFFICIENT CORE-SHELL PARYLENE COATING IMPROVING WIRE BOND STIFFNESS AND DAMPING
National phase entry is expected:
Publication Number
WO/2025/177211
Publication Date
28.08.2025
International Application No.
PCT/IB2025/051845
International Filing Date
20.02.2025
Title **
[English]
COST-EFFICIENT CORE-SHELL PARYLENE COATING IMPROVING WIRE BOND STIFFNESS AND DAMPING
[French]
REVÊTEMENT PARYLÈNE À STRUCTURE NOYAU-ENVELOPPE RENTABLE AMÉLIORANT LA RIGIDITÉ ET L'AMORTISSEMENT D'UNE CONNEXION À FIL
Applicants **
BAKER HUGHES INTEQ GMBH
Inventors
LEWIN, Martin
REINKER, Johannes
JURK, Tobias
SCHNOEING, Christian
SCHWENGBER, Moritz
MOLDENHAUER, Karsten
Priority Data
63/556,152
21.02.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2197 | |
| EPO | Filing, Examination, Granting | 11330 | |
| Japan | Filing, Examination, Granting | 2387 | |
| South Korea | Filing, Examination, Granting | 2387 | |
| USA | Filing, Examination, Granting | 4940 |
Total:
23,241
Abstract[English]
A wire is bonded between a first surface and a second surface of an electronics package having a wire assembly. A core layer is applied to the wire to surround the wire, wherein the core layer has a first density. A shell layer is applied to the core layer to surround the core layer, wherein the shell layer has a second density. The first density is less than the second density.[French]
Un fil est connecté entre une première surface et une deuxième surface d'un boîtier électronique comportant un ensemble fil. Une couche centrale est appliquée au fil pour entourer le fil, la couche centrale présentant une première densité. Une couche d'enveloppe est appliquée à la couche centrale pour entourer la couche centrale, la couche d'enveloppe présentant une deuxième densité. La première densité est inférieure à la deuxième densité.