WO2025169116 - INTEGRATION PLATFORM FOR MICRODEVICES
National phase entry is expected:
Publication Number
WO/2025/169116
Publication Date
14.08.2025
International Application No.
PCT/IB2025/051273
International Filing Date
06.02.2025
Title **
[English]
INTEGRATION PLATFORM FOR MICRODEVICES
[French]
PLATEFORME D'INTÉGRATION POUR MICRODISPOSITIFS
Applicants **
VUEREAL INC.
Inventors
CHAJI, Gholamreza
Priority Data
63/550,576
06.02.2024
US
63/691,872
06.09.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
CIPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2040 | |
| EPO | Filing, Examination, Granting | 11606 | |
| Japan | Filing, Examination, Granting | 2049 | |
| South Korea | Filing, Examination, Granting | 1887 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,322
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Abstract[English]
This disclosure is related to arranging a system comprising of backplane and microdevices. In addition, use of conductive or ohmic contact layer, transparent layer and a reflective layer is discussed. The present also discloses a method of integrating microdevices into a system substrate. In particular, transfer of microdevices using a system substrate using hollow adhesive pads is discussed.[French]
La présente divulgation concerne l'agencement d'un système comprenant un fond de panier et des microdispositifs. De plus, l'utilisation d'une couche de contact conductrice ou ohmique, d'une couche transparente et d'une couche réfléchissante est décrite. La présente invention concerne également un procédé d'intégration de microdispositifs dans un substrat de système. En particulier, l'invention concerne le transfert de microdispositifs à l'aide d'un substrat de système à l'aide de pastilles adhésives creuses.