WO2024069408 - SYSTEMS AND METHODS FOR SPACER FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE

National phase entry:
Publication Number WO/2024/069408
Publication Date 04.04.2024
International Application No. PCT/IB2023/059522
International Filing Date 26.09.2023
Title **
[English] SYSTEMS AND METHODS FOR SPACER FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
[French] SYSTÈMES ET PROCÉDÉS POUR ESPACEUR POUR MODULE D'ALIMENTATION POUR ONDULEUR POUR VÉHICULE ÉLECTRIQUE
Applicants **
BORGWARNER US TECHNOLOGIES LLC
Inventors
CHOI, Edward
Priority Data
63/377,486   28.09.2022   US
63/377,501   28.09.2022   US
63/377,512   28.09.2022   US
63/378,601   06.10.2022   US
18/162,031   31.01.2023   US
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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2495
EPO Filing, Examination, Granting11108
Japan Filing, Examination, Granting2328
South Korea Filing, Examination, Granting2474
USA Filing, Examination, Granting6540
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Total: 24,945

The term for entry into the National Phase has expired. This quotation is for informational purposes only

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Abstract[English] A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module for an inverter for an electric vehicle, the power module comprising: a first substrate having an outer layer and an inner layer; a first electrically conductive spacer coupled to the inner layer of the first substrate; a first semiconductor die coupled to the first electrically conductive spacer; and a second substrate having an outer layer and an inner layer, the first semiconductor die coupled to the inner layer of the second substrate.[French] Un système comprend : un onduleur configuré pour convertir une alimentation en courant continu d'une batterie en alimentation en courant alternatif en vue d'entraîner un moteur, l'onduleur comprenant un module d'alimentation pour un onduleur pour un véhicule électrique, le module d'alimentation comprenant un premier substrat possédant une couche externe et une couche interne, un premier espaceur électriquement conducteur couplé à la couche interne du premier substrat, une première puce semiconductrice couplée au premier espaceur électriquement conducteur, et un second substrat possédant une couche externe et une couche interne, la première puce semiconductrice étant couplée à la couche interne du second substrat.

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