WO2023233377 - COMPOSITION COMPRISING COPPER-BASED FUNGICIDE

National phase entry:
Publication Number WO/2023/233377
Publication Date 07.12.2023
International Application No. PCT/IB2023/055703
International Filing Date 02.06.2023
Title **
[English] COMPOSITION COMPRISING COPPER-BASED FUNGICIDE
[French] COMPOSITION COMPRENANT UN FONGICIDE À BASE DE CUIVRE
Applicants **
ADAMA MAKHTESHIM LTD.
Inventors
ADHIMOOLAM, Arunagirinathan Manickam
JUTHIGA VV, Krishna Vasu
Priority Data
202211031593   02.06.2022   IN
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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting3122
EPO Filing, Examination, Granting23586
Japan Filing, Examination, Granting3040
South Korea Filing, Examination, Granting3802
USA Filing, Examination, Granting12340
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Total: 45,890

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Abstract[English] The present invention provides a composition comprising (1) a copper-based fungicide, (2) water and (3) at least one surfactant selected from the group consisting of taurate-based surfactants, isethionate-based surfactants, and any combination thereof, wherein the copper-based fungicide is suspended in the water. The present invention also provides processes for preparing the herein described compositions and methods of their use.[French] La présente invention concerne une composition comprenant (1) un fongicide à base de cuivre, (2) de l'eau et (3) au moins un tensioactif choisi dans le groupe constitué par les tensioactifs à base de taurate, les tensioactifs à base d'iséthionate, et n'importe quelle combinaison de ceux-ci, le fongicide à base de cuivre étant en suspension dans l'eau. La présente invention concerne également des procédés de préparation des compositions décrites dans la description et leurs procédés d'utilisation.

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