WO2023148568 - RFID DEVICE FOR INJECTION MOLDING
National phase entry:
Publication Number
WO/2023/148568
Publication Date
10.08.2023
International Application No.
PCT/IB2023/050440
International Filing Date
18.01.2023
Title **
[English]
RFID DEVICE FOR INJECTION MOLDING
[French]
DISPOSITIF RFID POUR MOULAGE PAR INJECTION
Applicants **
AVERY DENNISON RETAIL INFORMATION SERVICES LLC
Inventors
CUMBY, Brad
PENTTILÄ, Katariina
VALTONEN, Antti
VUORINEN, Tiina
Priority Data
63/305,504
01.02.2022
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1994 | |
| EPO | Filing, Examination, Granting | 8143 | |
| Japan | Filing, Examination, Granting | 2150 | |
| South Korea | Filing, Examination, Granting | 1982 | |
| USA | Filing, Examination, Granting | 5940 |
Total:
20,209
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The invention relates to a Radio-Frequency Identification (RFID) device for an injection molded product comprising layers of different components to reduce thermal shrinkage or expansion and failure of the RFID inlay due to the high temperatures during injection molding. The introduced device allows for a thin build and a flat, smooth injection molded product.[French]
L'invention concerne un dispositif d'identification par radiofréquence (RFID) pour un produit moulé par injection comprenant des couches de différents composants pour réduire le retrait par refroidissement ou l'expansion et la défaillance de l'incrustation RFID en raison des températures élevées pendant le moulage par injection. Le dispositif introduit permet une construction mince et un produit moulé par injection lisse et plat.