WO2025027274 - TREATMENT OF PARTICULATE FILTERS
National phase entry:
Publication Number
WO/2025/027274
Publication Date
06.02.2025
International Application No.
PCT/GB2024/051891
International Filing Date
19.07.2024
Title **
[English]
TREATMENT OF PARTICULATE FILTERS
[French]
TRAITEMENT DE FILTRES À PARTICULES
Applicants **
JOHNSON MATTHEY PUBLIC LIMITED COMPANY
Inventors
HOTCHKISS, Thomas
NISBET, Jordan
THOMSON, Craig
Priority Data
63/517,118
02.08.2023
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2080 | |
| EPO | Filing, Examination, Granting | 9139 | |
| Japan | Filing, Examination, Granting | 2234 | |
| South Korea | Filing, Examination, Granting | 2167 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
20,360
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A method and apparatus for applying a dry powder to a porous substrate (10) comprising: a) locating the porous substrate (10) in a holder (2) such that an inlet face (11) is in communication with an inlet chamber (15) and an outlet face (12) is in communication with a vacuum generator; b) establishing a primary gas flow through the porous substrate (10) using the vacuum generator to apply a pressure reduction to the outlet face (12); c) spraying the dry powder into or within the inlet chamber (15) such that dry powder is entrained in the primary gas flow and passes through the inlet face (11) of the porous substrate (10) to contact a porous structure (13) of the porous substrate (10); d) during the spraying of the dry powder directing a secondary gas flow onto and/or across the inlet face of the porous substrate (10); and e) using a pressure and/or a flow rate of the secondary gas flow to control an axial distribution of the dry powder that is deposited in the porous structure (13) of the porous substrate (10).[French]
L'invention concerne un procédé et un appareil pour appliquer une poudre sèche sur un substrat poreux (10) comprenant : a) la localisation du substrat poreux (10) dans un support (2) de telle sorte qu'une face d'entrée (11) est en communication avec une chambre d'entrée (15) et une face de sortie (12) est en communication avec un générateur de vide ; b) l'établissement d'un flux de gaz primaire à travers le substrat poreux (10) à l'aide du générateur de vide pour appliquer une réduction de pression à la face de sortie (12) ; c) pulvériser la poudre sèche dans ou à l'intérieur de la chambre d'entrée (15) de telle sorte que la poudre sèche est entraînée dans le flux de gaz primaire et passe à travers la face d'entrée (11) du substrat poreux (10) pour entrer en contact avec une structure poreuse (13) du substrat poreux (10) ; d) pendant la pulvérisation de la poudre sèche dirigeant un flux de gaz secondaire sur et/ou à travers la face d'entrée du substrat poreux (10) ; et e) utiliser une pression et/ou un débit du flux de gaz secondaire pour commander une distribution axiale de la poudre sèche qui est déposée dans la structure poreuse (13) du substrat poreux (10).