WO2026131051 - MULTI-LAYER PLANAR MAGNETIC COIL
National phase entry is expected:
Publication Number
WO/2026/131051
Publication Date
25.06.2026
International Application No.
PCT/EP2025/084792
International Filing Date
28.11.2025
Title **
[English]
MULTI-LAYER PLANAR MAGNETIC COIL
[French]
BOBINE MAGNÉTIQUE PLANE MULTICOUCHE
Applicants **
BSH HAUSGERÄTE GMBH
Inventors
VELEZ PELLICER, Eduardo
RODRIGUEZ, Fernando
SCHINDLER, Daniel
Priority Data
24383375.3
16.12.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2023 | |
| EPO | Filing, Examination, Granting | 8159 | |
| Japan | Filing, Examination, Granting | 2171 | |
| South Korea | Filing, Examination, Granting | 2051 | |
| USA | Filing, Examination, Granting | 6540 |
Total:
20,944
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Abstract[English]
A multi-layer coil (110) is described, wherein the multi-layer coil (110) comprises a first planar sub-coil (131) on a first layer and a second planar sub-coil (132) on a second layer of a circuit board (101), the first layer and the second layer are located above one another along a z-axis which is perpendicular to the first and the second layer of the circuit board (101). The first sub-coil (131) and the second sub-coil (132) each comprise an electrical, line-shaped, conductor (115) which forms M windings of the respective sub-coil (131, 132), with M≥ 2, wherein adjacent windings of the first sub-coil (131) and adjacent windings of the second sub-coil (132) are each separated by a gap (221). The first sub-coil (131) and the second sub-coil (132) are interleaved with respect to one another, such that the conductor (115) of the first sub-coil (131) is at least partially located along the z-axis directly above a gap (221) between adjacent windings of the second sub-coil (132).[French]
L'invention concerne une bobine multicouche (110), la bobine multicouche (110) comprenant une première sous-bobine plane (131) sur une première couche et une seconde sous-bobine plane (132) sur une seconde couche d'une carte (101) de circuit imprimé, la première couche et la seconde couche étant situées l'une au-dessus de l'autre suivant un axe z qui est perpendiculaire à la première et à la seconde couche de la carte (101) de circuit imprimé. La première sous-bobine (131) et la seconde sous-bobine (132) comprennent chacune un conducteur électrique (115) en forme de ligne qui forme M enroulements de la sous-bobine respective (131, 132), avec M ≥ 2, des enroulements adjacents de la première sous-bobine (131) et des enroulements adjacents de la seconde sous-bobine (132) étant chacun séparés par un espace (221). La première sous-bobine (131) et la seconde sous-bobine (132) sont entrelacées l'une par rapport à l'autre, de telle sorte que le conducteur (115) de la première sous-bobine (131) est au moins partiellement situé suivant l'axe z directement au-dessus d'un espace (221) entre des enroulements adjacents de la seconde sous-bobine (132).