WO2026047193 - FIXIERMATERIAL FÜR ELEKTRONISCHE BAUTEILE
National phase entry is expected:
Publication Number
WO/2026/047193
Publication Date
05.03.2026
International Application No.
PCT/EP2025/074650
International Filing Date
29.08.2025
Title **
[German]
FIXIERMATERIAL FÜR ELEKTRONISCHE BAUTEILE
[English]
FIXING MATERIAL FOR ELECTRONIC COMPONENTS
[French]
MATÉRIAU DE FIXATION POUR COMPOSANTS ÉLECTRONIQUES
Applicants **
ROBERT BOSCH GMBH
Inventors
SRANKO, David
Priority Data
102024208261.9
30.08.2024
DE
Application details
| Total Number of Claims/PCT | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2023 | |
| EPO | Filing, Examination, Granting | 8159 | |
| Japan | Filing, Examination, Granting | 2170 | |
| South Korea | Filing, Examination, Granting | 2051 | |
| USA | Filing, Examination, Granting | 5340 |

Total:
19,743
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Abstract[German]
Die vorliegende Erfindung betrifft Fixiermaterial für elektronische Bauteile, eingerichtet zur elektrischen Verbindung eines ersten Bauteils mit einem zweiten Bauteil, wobei das Fixiermaterial pastös und elektrisch leitfähig ist, und wobei das Fixiermaterial ein photochemisch härtbares Material umfasst, welches eingerichtet ist, das Fixiermaterial derart zu versteifen, dass eine Relativposition zwischen dem ersten und zweiten elektronischen Bauteil vorfixiert ist.[English]
The present invention relates to fixing material for electronic components, designed for electrically connecting a first component to a second component, wherein the fixing material is pasty and electrically conductive, and wherein the fixing material comprises a photochemically curable material which is designed to stiffen the fixing material in such a way that a relative position between the first and second electronic components is prefixed.[French]
La présente invention se rapporte à un matériau de fixation pour composants électroniques, conçu pour connecter électriquement un premier composant à un second composant, le matériau de fixation étant pâteux et électroconducteur, et le matériau de fixation comprenant un matériau photochimiquement durcissable qui est conçu pour rigidifier le matériau de fixation de telle sorte qu'une position relative entre les premier et second composants électroniques soit préfixée.