WO2026047193 - FIXIERMATERIAL FÜR ELEKTRONISCHE BAUTEILE

National phase entry is expected:
Publication Number WO/2026/047193
Publication Date 05.03.2026
International Application No. PCT/EP2025/074650
International Filing Date 29.08.2025
Title **
[German] FIXIERMATERIAL FÜR ELEKTRONISCHE BAUTEILE
[English] FIXING MATERIAL FOR ELECTRONIC COMPONENTS
[French] MATÉRIAU DE FIXATION POUR COMPOSANTS ÉLECTRONIQUES
Applicants **
ROBERT BOSCH GMBH
Inventors
SRANKO, David
Priority Data
102024208261.9   30.08.2024   DE
Application details
Total Number of Claims/PCT *
Number of Independent Claims *
Number of Priorities *
Number of Multi-Dependent Claims *
Number of Drawings *
Pages for Publication *
Number of Pages with Drawings *
Pages of Specification *
*
Number of Office Actions *
*
International Searching Authority
*
Recordal of a Change of the Applicant's Name/Address
*
Type of Assignment
*
Applicant's Legal Status
*
*
*
*
*
*
Entry into National Phase under
*
Patent Delivery
*
Translation

* The data is based on automatic recognition. Please verify and amend if necessary.

** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.

Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2023
EPO Filing, Examination, Granting8159
Japan Filing, Examination, Granting2170
South Korea Filing, Examination, Granting2051
USA Filing, Examination, Granting5340
MasterCard Visa
Total: 19,743
Contact Us
Abstract[German] Die vorliegende Erfindung betrifft Fixiermaterial für elektronische Bauteile, eingerichtet zur elektrischen Verbindung eines ersten Bauteils mit einem zweiten Bauteil, wobei das Fixiermaterial pastös und elektrisch leitfähig ist, und wobei das Fixiermaterial ein photochemisch härtbares Material umfasst, welches eingerichtet ist, das Fixiermaterial derart zu versteifen, dass eine Relativposition zwischen dem ersten und zweiten elektronischen Bauteil vorfixiert ist.[English] The present invention relates to fixing material for electronic components, designed for electrically connecting a first component to a second component, wherein the fixing material is pasty and electrically conductive, and wherein the fixing material comprises a photochemically curable material which is designed to stiffen the fixing material in such a way that a relative position between the first and second electronic components is prefixed.[French] La présente invention se rapporte à un matériau de fixation pour composants électroniques, conçu pour connecter électriquement un premier composant à un second composant, le matériau de fixation étant pâteux et électroconducteur, et le matériau de fixation comprenant un matériau photochimiquement durcissable qui est conçu pour rigidifier le matériau de fixation de telle sorte qu'une position relative entre les premier et second composants électroniques soit préfixée.

Rejoining the server...