WO2025214686 - A THERMALLY DEBONDABLE TWO-COMPONENT EPOXY ADHESIVE COMPOSITION
National phase entry is expected:
Publication Number
WO/2025/214686
Publication Date
16.10.2025
International Application No.
PCT/EP2025/056572
International Filing Date
11.03.2025
Title **
[English]
A THERMALLY DEBONDABLE TWO-COMPONENT EPOXY ADHESIVE COMPOSITION
[French]
COMPOSITION ADHÉSIVE ÉPOXY À DEUX COMPOSANTS DÉCOLLABLE THERMIQUEMENT
Applicants **
HENKEL AG & CO. KGAA
Inventors
MIGLIORE, Nicola
GUTSCHE, Nadine
NIEGEMEIER, Andreas
KOHLSTRUNG, Rainer
FRANKEN, Uwe
Priority Data
24169602.0
11.04.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2111 | |
| EPO | Filing, Examination, Granting | 9683 | |
| Japan | Filing, Examination, Granting | 2267 | |
| South Korea | Filing, Examination, Granting | 2236 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
21,037
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Abstract[English]
The present invention relates to use a thermally debondable two-component epoxy adhesive composition, or cured product according to the present invention in a bonded structure, wherein the bonded structures are for example e-mobility related components.[French]
La présente invention concerne l'utilisation d'une composition adhésive époxy à deux composants décollable thermiquement, ou d'un produit durci selon la présente invention dans une structure liée, les structures liées étant par exemple des composants liés à la mobilité électronique.