WO2025168788 - A DISPENSING DEVICE ARRANGED FOR DISPENSING SOLDER PASTE AS WELL AS A CORRESPONDING SOLDER DOT DISPENSING DEVICE AND A RELATED METHOD
National phase entry is expected:
Publication Number
WO/2025/168788
Publication Date
14.08.2025
International Application No.
PCT/EP2025/053281
International Filing Date
07.02.2025
Title **
[English]
A DISPENSING DEVICE ARRANGED FOR DISPENSING SOLDER PASTE AS WELL AS A CORRESPONDING SOLDER DOT DISPENSING DEVICE AND A RELATED METHOD
[French]
DISPOSITIF DE DISTRIBUTION CONÇU POUR DISTRIBUER UNE PÂTE À BRASER AINSI QUE DISPOSITIF DE DISTRIBUTION DE POINTS DE BRASURE CORRESPONDANT ET PROCÉDÉ ASSOCIÉ
Applicants **
NEXPERIA B.V.
Inventors
LE, Fred Fuliang
Priority Data
24156856.7
09.02.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2023 | |
| EPO | Filing, Examination, Granting | 8149 | |
| Japan | Filing, Examination, Granting | 2169 | |
| South Korea | Filing, Examination, Granting | 2050 | |
| USA | Filing, Examination, Granting | 5340 |
Total:
19,731
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Abstract[English]
A dispensing device arranged for dispensing solder paste, said dispensing device comprising a dispensing reservoir arranged for containing said solder paste, a channel arranged for receiving, at an inlet thereof, said solder paste from said dispensing reservoir and for dispensing said solder paste at an outlet thereof, an elongated sealing element positioned in said channel, a buffer chamber arranged for buffering solder paste, wherein said buffer chamber is connected to said channel, wherein said elongated sealing element is arranged to provide a passageway between said dispensing reservoir and said buffer chamber in a closed state and arranged to provide a passageway between said buffer chamber and said outlet of said channel in an opened state.[French]
Dispositif de distribution conçu pour distribuer une pâte à braser, ledit dispositif de distribution comprenant un réservoir de distribution conçu pour contenir ladite pâte à braser, un canal conçu pour recevoir, au niveau d'une entrée de celui-ci, ladite pâte à braser dudit réservoir de distribution et pour distribuer ladite pâte à braser au niveau d'une sortie de celui-ci, un élément d'étanchéité allongé positionné dans ledit canal, une chambre tampon conçue pour amortir une pâte à braser, ladite chambre tampon étant reliée audit canal, ledit élément d'étanchéité allongé étant conçu pour fournir un passage entre ledit réservoir de distribution et ladite chambre tampon dans un état fermé et conçu pour fournir un passage entre ladite chambre tampon et ladite sortie dudit canal dans un état ouvert.