WO2025176460 - ELECTRICALLY CONDUCTIVE ADHESIVE
National phase entry is expected:
Publication Number
WO/2025/176460
Publication Date
28.08.2025
International Application No.
PCT/EP2025/052870
International Filing Date
05.02.2025
Title **
[English]
ELECTRICALLY CONDUCTIVE ADHESIVE
[French]
ADHÉSIF ÉLECTROCONDUCTEUR
Applicants **
HENKEL AG & CO. KGAA
Inventors
SMANIOTTO, Fabio
BUCKLAND, Daniel
Priority Data
24159168.4
22.02.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2052 | |
| EPO | Filing, Examination, Granting | 8672 | |
| Japan | Filing, Examination, Granting | 2202 | |
| South Korea | Filing, Examination, Granting | 2112 | |
| USA | Filing, Examination, Granting | 5340 |
Total:
20,378
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Abstract[English]
The present invention relates to an electrically conductive adhesive for attaching solar cells together in a shingled photovoltaic module or in a ribbon-attached photovoltaic module, wherein the adhesive provides the required viscosity, adhesion, and electrical conductivity on non-noble metals such as tin, tin-lead alloy, tin-lead bismuth alloy and copper.[French]
La présente invention concerne un adhésif électroconducteur pour fixer des cellules solaires ensemble dans un module photovoltaïque en panneaux ou dans un module photovoltaïque fixé par ruban, l'adhésif fournissant la viscosité, l'adhérence et la conductivité électrique requises par l'usage de métaux non nobles tels que l'étain, l'alliage étain-plomb, l'alliage étain-plomb-bismuth et le cuivre.