WO2025168316 - ELEKTRONISCHES MODUL MIT WENIGSTENS EINEM LEISTUNGSHALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
National phase entry is expected:
Publication Number
WO/2025/168316
Publication Date
14.08.2025
International Application No.
PCT/EP2025/051106
International Filing Date
17.01.2025
Title **
[German]
ELEKTRONISCHES MODUL MIT WENIGSTENS EINEM LEISTUNGSHALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
[English]
ELECTRONIC MODULE HAVING AT LEAST ONE POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
[French]
MODULE ÉLECTRONIQUE AYANT AU MOINS UN COMPOSANT SEMI-CONDUCTEUR DE PUISSANCE ET SON PROCÉDÉ DE PRODUCTION
Applicants **
ROBERT BOSCH GMBH
Inventors
ZILLMANN, Benjamin
WAYAND, Hartmut
MECKBACH, Johannes
FISCHER, Arne Stephen
Priority Data
102024201144.4
08.02.2024
DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1940 | |
| EPO | Filing, Examination, Granting | 8218 | |
| Japan | Filing, Examination, Granting | 2104 | |
| South Korea | Filing, Examination, Granting | 1828 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,830
Abstract[German]
Die Erfindung betrifft ein elektronisches Modul (100) mit wenigstens einem Leistungshalbleiterbauelement (10), das mit Stromführungselementen (22) elektrisch kontaktiert ist, und mit wenigstens einem Kühlelement (26, 28) zur zumindest mittelbaren Kühlung des wenigstens einen Leistungshalbleiterbauelements (10), wobei das wenigstens eine Kühlelement (26, 28) optional als ein in einem additiven Fertigungsverfahren hergestelltes Kühlelement (26, 28) ausgebildet sein kann.[English]
The invention relates to an electronic module (100) having at least one power semiconductor component (10) which is in electrical contact with current-carrying elements (22), and having at least one cooling element (26, 28) for at least indirectly cooling the at least one power semiconductor component (10), wherein the at least one cooling element (26, 28) can optionally be in the form of a cooling element (26, 28) produced in an additive manufacturing method.[French]
L'invention concerne un module électronique (100) possédant au moins un composant semi-conducteur de puissance (10) qui est en contact électrique avec des éléments porteurs de courant (22), et présentant au moins un élément de refroidissement (26, 28) pour refroidir au moins indirectement ledit au moins un composant semi-conducteur de puissance (10), ledit au moins un élément de refroidissement (26, 28) pouvant éventuellement se présenter sous la forme d'un élément de refroidissement (26, 28) produit dans un procédé de fabrication additive.