WO2026017271 - A METHOD FOR MOUNTING AN ELECTRONICS COMPONENT AT A PARTICULAR PLACEMENT LOCATION ON A CARRIER AS WELL AS A PICK-AND-PLACE APPARATUS FOR MOUNTING AN ELECTRONICS COMPONENT AT A PARTICULAR PLACEMENT LOCATION ON A CARRIER.
National phase entry is expected:
Publication Number
WO/2026/017271
Publication Date
22.01.2026
International Application No.
PCT/EP2024/070643
International Filing Date
19.07.2024
Title **
[English]
A METHOD FOR MOUNTING AN ELECTRONICS COMPONENT AT A PARTICULAR PLACEMENT LOCATION ON A CARRIER AS WELL AS A PICK-AND-PLACE APPARATUS FOR MOUNTING AN ELECTRONICS COMPONENT AT A PARTICULAR PLACEMENT LOCATION ON A CARRIER.
[French]
PROCÉDÉ DE MONTAGE D'UN COMPOSANT ÉLECTRONIQUE À UN EMPLACEMENT PARTICULIER SUR UN SUPPORT AINSI QU'UN APPAREIL DE MANUTENTION POUR LE MONTAGE D'UN COMPOSANT ÉLECTRONIQUE À UN EMPLACEMENT PARTICULIER SUR UN SUPPORT
Applicants **
NEXPERIA B.V.
Inventors
STOKKERMANS, Joep
KUIPERS, Johannes Josinus
WESSELINGH, Jasper
POELMA, Regnerus Hermannus
BEKOOIJ, Bastiaan
ABDELWAHAB, Ahmed
VAN HOORN, Remco
MASTRANGELI, Massimo
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1950 | |
| EPO | Filing, Examination, Granting | 8143 | |
| Japan | Filing, Examination, Granting | 2181 | |
| South Korea | Filing, Examination, Granting | 1951 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,965
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Abstract[English]
According to a first example of the disclosure, a method for mounting an electronics component at a particular placement location on a carrier is suggested. The method comprising the steps of: i) providing the carrier; ii) applying an adhesive layer at least on the particular location on the carrier; iii) positioning, using a component pick up unit holding the electronics component in an engaging manner, the electronics component above the particular placement location on the carrier; iv) positioning, using the component pick up unit, the electronics component at a placement level above the particular placement location without contacting the adhesive layer or the carrier; v) disengaging the component pick up unit holding the electronics component to be mounted, thereby vi) dropping the electronics component to be mounted at the particular placement location on the carrier.[French]
Selon un premier exemple de la divulgation, celle-ci concerne un procédé de montage d'un composant électronique à un emplacement particulier sur un support. Le procédé comprend les étapes consistant à : i) fournir le support ; ii) appliquer une couche adhésive au moins sur l'emplacement particulier sur le support ; iii) positionner, à l'aide d'une unité de saisie de composant retenant le composant électronique de manière à être en prise, le composant électronique au-dessus de l'emplacement particulier sur le support ; iv) positionner, à l'aide de l'unité de saisie de composant, le composant électronique à un niveau d'emplacement au-dessus de l'emplacement particulier sans entrer en contact avec la couche adhésive ou le support ; v) libérer l'unité de saisie de composant retenant le composant électronique à monter, vi) laisser ainsi tomber le composant électronique à monter à l'emplacement particulier sur le support.