WO2025247507 - APPARATUS FOR TRANSFERRING A SEMICONDUCTOR DIE FROM AN ARRANGEMENT OF SEMICONDUCTOR DIES TO A TARGET
National phase entry is expected:
Publication Number
WO/2025/247507
Publication Date
04.12.2025
International Application No.
PCT/EP2024/065112
International Filing Date
31.05.2024
Title **
[English]
APPARATUS FOR TRANSFERRING A SEMICONDUCTOR DIE FROM AN ARRANGEMENT OF SEMICONDUCTOR DIES TO A TARGET
[French]
APPAREIL DE TRANSFERT D'UNE PUCE SEMI-CONDUCTRICE D'UN AGENCEMENT DE PUCES SEMI-CONDUCTRICES VERS UNE CIBLE
Applicants **
NEXPERIA B.V.
Inventors
STOKKERMANS, Joep
WESSELINGH, Jasper
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1923 | |
| EPO | Filing, Examination, Granting | 8147 | |
| Japan | Filing, Examination, Granting | 2142 | |
| South Korea | Filing, Examination, Granting | 1897 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,849
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Abstract[English]
The present disclosure proposes an apparatus for transferring a semiconductor die (2) from an arrangement of semiconductor dies to a target. The apparatus according to the disclosure comprises a wafer stage (5) which is configured to receive a flexible carrier (14) on which the arrangement of semiconductor dies can be arranged, wherein the flexible carrier (14) is a sheet like element having at least two pairs of opposite edges wherein opposite edges are at least partially substantially parallel, wherein the wafer stage (5) comprising: a releasing unit (4) for releasing a semiconductor die from the arrangement of semiconductor dies, a controller for controlling the releasing unit and/or the wafer stage, a first archlike edge mount (7a) suitable for receiving first edge of flexible carrier (14) and a second archlike edge mount (7b) suitable for receiving second edge of flexible carrier (14) opposite the edge received by the first archlike edge mount (7a) at least two motors (16) having common rotation axis each coupled to the archlike edge mounts (7a, 7b) accordingly, wherein the two motors are configured for synchronously rotating each of the archlike edge mounts (7a, 7b) around a rotational axis.[French]
La présente divulgation concerne un appareil de transfert d'une puce semi-conductrice (2) d'un agencement de puces semi-conductrices vers une cible. L'appareil selon l'invention comprend un étage de tranche (5) qui est configuré pour recevoir un support souple (14) sur lequel l'agencement de puces semi-conductrices peut être agencé ; le support souple (14) est un élément à feuille ayant au moins deux paires de bords opposés, des bords opposés étant au moins partiellement sensiblement parallèles ; l'étage de tranche (5) comprend : une unité de libération (4) permettant de libérer une puce semi-conductrice de l'agencement de puces semi-conductrices, un dispositif de commande pour commander l'unité de libération et/ou l'étage de tranche, un premier support de bord en forme d'arc (7a) approprié pour recevoir un premier bord de support flexible (14) et un second support de bord en forme d'arc (7b) approprié pour recevoir un second bord de support flexible (14) opposé au bord reçu par le premier support de bord en forme d'arc (7a) , et au moins deux moteurs (16) ayant un axe de rotation commun chacun couplé aux supports de bord en forme d'arc (7a, 7b) en conséquence ; lesdits deux moteurs sont configurés pour faire tourner de manière synchrone chacun des supports de bord en forme d'arc (7a, 7b) autour d'un axe de rotation.