WO2025237509 - SUBSTRATE TREATMENT APPARATUS ALLOWING FOR AN ALTERNATIVE CLEANING, METHOD OF CLEANING AND USE OF THE APPARATUS
National phase entry is expected:
Publication Number
WO/2025/237509
Publication Date
20.11.2025
International Application No.
PCT/EP2024/063164
International Filing Date
14.05.2024
Title **
[English]
SUBSTRATE TREATMENT APPARATUS ALLOWING FOR AN ALTERNATIVE CLEANING, METHOD OF CLEANING AND USE OF THE APPARATUS
[French]
APPAREIL DE TRAITEMENT DE SUBSTRAT PERMETTANT UN NETTOYAGE ALTERNATIF, PROCÉDÉ DE NETTOYAGE ET UTILISATION DE L'APPAREIL
Applicants **
EVATEC AG
Inventors
KAISER, Simon
HERMANN, Björn
MARTI, Michel
PATSCHEIDER, Jörg
HARTMANN, Dominik
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2912 | |
| EPO | Filing, Examination, Granting | 21522 | |
| Japan | Filing, Examination, Granting | 2921 | |
| South Korea | Filing, Examination, Granting | 3441 | |
| USA | Filing, Examination, Granting | 11540 |
Total:
42,336
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Abstract[English]
The invention relates to the technical field of substrate surface treatment by plasma etching and/or atomic layer deposition. A substrate processing apparatus (1) comprising at least one magnet arrangement recipient (13) adapted to receive a magnet arrangement (9) is provided. When the magnet arrangement (9) is received by the magnet arrangement recipient (13), no electron cyclotron resonance (ECR) is provided inside the apparatus (1). Furthermore, a substrate processing apparatus (1) comprising at least one microwave transmissive material window (16) having an electrically conductive frame (17) and one or multiple electrically conductive wires (18) is provided to attract cleaning gas ions. Moreover, a method of in-situ cleaning of a substrate processing apparatus (1) and a use of the apparatus (1) and of the method are provided.[French]
L'invention concerne le domaine technique du traitement de surface de substrat par gravure par plasma et/ou dépôt de couche atomique. L'invention propose un appareil de traitement de substrat (1) comprenant au moins un récipient d'agencement d'aimants (13) conçu pour recevoir un agencement d'aimants (9). Lorsque l'agencement d'aimants (9) est reçu par le récipient d'agencement d'aimants (13), aucune résonance cyclotronique électronique (ECR) n'est disposée à l'intérieur de l'appareil (1). En outre, un appareil de traitement de substrat (1) comprenant au moins une fenêtre de matériau transmettant les micro-ondes (16) présentant un cadre électroconducteur (17) et un ou plusieurs fils électroconducteurs (18) est prévu pour attirer des ions de gaz de nettoyage. De plus, l'invention propose un procédé de nettoyage in situ d'un appareil de traitement de substrat (1) et une utilisation de l'appareil (1) et du procédé.