WO2024200033 - COMPONENT CARRIER WITH STACK AND OPTICAL LAYER BUILD-UP FOR OPTICAL CHIP
National phase entry:
Publication Number
WO/2024/200033
Publication Date
03.10.2024
International Application No.
PCT/EP2024/056845
International Filing Date
14.03.2024
Title **
[English]
COMPONENT CARRIER WITH STACK AND OPTICAL LAYER BUILD-UP FOR OPTICAL CHIP
[French]
PORTEUSE COMPOSANTE AVEC PILE ET CONSTRUCTION DE COUCHE OPTIQUE POUR PUCE OPTIQUE
Applicants **
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Inventors
JOERG, Tanja
Priority Data
102023107634.5
27.03.2023
DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2942 | |
| EPO | Filing, Examination, Granting | 21302 | |
| Japan | Filing, Examination, Granting | 2904 | |
| South Korea | Filing, Examination, Granting | 3544 | |
| USA | Filing, Examination, Granting | 11540 |
Total:
42,232
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A component carrier (100), which comprises a stack (102, 108) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (106), a double cavity (114) formed in, on and/or above the stack (102, 108) and comprising a first cavity (116) being arranged in a stepped configuration with a second cavity (118), and an optical chip (112) arranged at least partially in the double cavity (114) so that the first cavity (116) provides an optical connection and the second cavity (118) provides an electric connection of the optical chip (112).[French]
Porteuse composante (100), qui comprend une pile (102, 108) comprenant au moins une structure de couche électriquement conductrice (104) et au moins une structure de couche électriquement isolante (106), une double cavité (114) formée dans, sur et/ou au-dessus de la pile (102, 108) et comprenant une première cavité (116) agencée dans une configuration étagée avec une seconde cavité (118), et une puce optique (112) disposée au moins partiellement dans la double cavité (114) de telle sorte que la première cavité (116) fournit une connexion optique et la seconde cavité (118) fournit une connexion électrique de la puce optique (112).