WO2024033118 - POWER-MODULE
National phase entry is expected:
Publication Number
WO/2024/033118
Publication Date
15.02.2024
International Application No.
PCT/EP2023/071038
International Filing Date
28.07.2023
Title **
[English]
POWER-MODULE
[French]
MODULE DE PUISSANCE
Applicants **
ZF FRIEDRICHSHAFEN AG
Inventors
LIU, Wei
Priority Data
102022208367.9
11.08.2022
DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1944 | |
| EPO | Filing, Examination, Granting | 8245 | |
| Japan | Filing, Examination, Granting | 2137 | |
| South Korea | Filing, Examination, Granting | 1915 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,981
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A power-module (20) is provided. The power-module (20) comprises: at least one semiconductor chip (24) and a carrier (22), on which the semiconductor chip (24) is mounted and which comprises at least one contact area (40) electrically coupled to the first semiconductor chip (24) by at least one conductor (44), wherein the conductor (44) comprises aluminum and copper.[French]
Un module de puissance (20) est prévu. Le module de puissance (20) comprend : au moins une puce semi-conductrice (24) et un support (22), sur lequel la puce semi-conductrice (24) est montée et qui comprend au moins une zone de contact (40) électriquement couplée à la première puce semi-conductrice (24) par au moins un conducteur (44), le conducteur (44) comprenant de l'aluminium et du cuivre.