WO2023110660 - THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME
National phase entry:
Publication Number
WO/2023/110660
Publication Date
22.06.2023
International Application No.
PCT/EP2022/085122
International Filing Date
09.12.2022
Title **
[English]
THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME
[French]
COMPOSITION DE FORMATION DE FILM ÉPAIS ET PROCÉDÉ DE FABRICATION DE FILM DURCI L'UTILISANT
Applicants **
MERCK PATENT GMBH
Inventors
NOJIMA, Yoshio
SEKITO, Takashi
HITOKAWA, Hiroshi
KUDO, Takanori
Priority Data
63/265,315
13.12.2021
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2310 | |
| EPO | Filing, Examination, Granting | 10806 | |
| Japan | Filing, Examination, Granting | 2285 | |
| South Korea | Filing, Examination, Granting | 2304 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,445
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A thick film-forming composition comprising a hydrocarbon- containing compound (A) having a certain structure and a solvent (B): wherein, the solvent (B) comprises an organic solvent (B1) and an organic solvent (B2) having a dielectric constant of 20.0 to 90.0; and the film thickness of the film formed from the thick film-forming composition is 0.5 to 10 μm.[French]
Composition filmogène épaisse comprenant un composé contenant des hydrocarbures (A) ayant une certaine structure et un solvant (B). Le solvant (B) comprend un solvant organique (B1) et un solvant organique (B2) ayant une constante diélectrique de 20,0 à 90,0 ; et l'épaisseur de film du film formé à partir de la composition filmogène épaisse est de 0,5 à 10 µm.