WO2023025454 - METHOD FOR DETACHING SUBSTRATES BONDED BY POLYURETHANE ADHESIVE
National phase entry:
Publication Number
WO/2023/025454
Publication Date
02.03.2023
International Application No.
PCT/EP2022/069543
International Filing Date
13.07.2022
Title **
[English]
METHOD FOR DETACHING SUBSTRATES BONDED BY POLYURETHANE ADHESIVE
[French]
PROCÉDÉ DE DÉTACHEMENT DE SUBSTRATS LIÉS PAR UN ADHÉSIF DE POLYURÉTHANE
Applicants **
HENKEL AG & CO. KGAA
Inventors
PARK, Gwanghyun
NAM, Arnold Yeonwoo
Priority Data
21192747.0
24.08.2021
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Pages of Specification | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1902 | |
| EPO | Filing, Examination, Granting | 8389 | |
| Japan | Filing, Examination, Granting | 2036 | |
| South Korea | Filing, Examination, Granting | 1804 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,871
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
Method for detaching two substrates bonded by a polyurethane adhesive, comprising the steps of: (1) treating a first substrate and a second substrate bonded by a polyurethane adhesive with a debonding agent comprising lactic acid at a temperature from 40°C to 90°C, and (2) separating the first substrate and the second substrate from the polyurethane adhesive.[French]
L'invention concerne un procédé de détachement de deux substrats liés par un adhésif de polyuréthane, comprenant les étapes consistant à : (1) traiter un premier substrat et un second substrat liés par un adhésif de polyuréthane avec un agent de décollement comprenant de l'acide lactique à une température de 40 °C à 90 °C, et (2) séparer le premier substrat et le second substrat de l'adhésif de polyuréthane.