WO2026046463 - ELEKTRISCHER VERBINDER
National phase entry is expected:
Publication Number
WO/2026/046463
Publication Date
05.03.2026
International Application No.
PCT/DE2025/100728
International Filing Date
31.07.2025
Title **
[German]
ELEKTRISCHER VERBINDER
[English]
ELECTRICAL CONNECTOR
[French]
CONNECTEUR ÉLECTRIQUE
Applicants **
SCHAEFFLER TECHNOLOGIES AG & CO. KG
Inventors
SCHULZ, Edgar
OETE, Mehmet
ETSCHEL, Sebastian
BRUGNARA, Ricardo Henrique
Priority Data
102024125027.5
02.09.2024
DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1879 | |
| EPO | Filing, Examination, Granting | 8159 | |
| Japan | Filing, Examination, Granting | 1953 | |
| South Korea | Filing, Examination, Granting | 1619 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,350
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Abstract[German]
-Anteil von größer als 50% als Bindungsart, welche undotiert ist oder eine Dotierung aus mindestens einem Element der Gruppe umfassend Kupfer, Wolfram, Molybdän, Chrom, Silber, Titan, Iridium, Gold, Silizium, in einer Konzentration im Bereich von 2 bis 30 at.-% aufweist.[English]
content of greater than 50% as bonding type, undoped or doped with at least one element from the group comprising copper, tungsten, molybdenum, chromium, silver, titanium, iridium, gold, silicon in a concentration in the range from 2 to 30 at%.[French]
supérieure à 50 % en tant que type de liaison, laquelle est non dopée, ou un dopage par au moins un élément du groupe comprenant le cuivre, le tungstène, le molybdène, le chrome, l'argent, le titane, l'iridium, l'or, le silicium, à une concentration comprise entre 2 et 30 % atomiques.