WO2025180553 - ELEKTRONIKMODUL UND VERFAHREN ZU SEINER HERSTELLUNG
National phase entry is expected:
Publication Number
WO/2025/180553
Publication Date
04.09.2025
International Application No.
PCT/DE2025/100038
International Filing Date
10.01.2025
Title **
[German]
ELEKTRONIKMODUL UND VERFAHREN ZU SEINER HERSTELLUNG
[English]
ELECTRONICS MODULE AND METHOD FOR PRODUCING SAME
[French]
MODULE ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION
Applicants **
SCHAEFFLER TECHNOLOGIES AG & CO. KG
Inventors
RITTGEROTT, Thorsten
PONGRATZ, Thomas
GRAMANN, Nicolai
JACKSTÄDT, Sebastian
HILGER, Gerd
STOCK, Dominik
Priority Data
102024105922.2
01.03.2024
DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1878 | |
| EPO | Filing, Examination, Granting | 8118 | |
| Japan | Filing, Examination, Granting | 1953 | |
| South Korea | Filing, Examination, Granting | 1614 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,303
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Abstract[German]
Elektronikmodul, umfassend eine Elektronikeinheit (2) und einen metallenen Kühlkörper (3) mit mehreren vorspringende Kühlelementen (6) sowie ein an den Kühlkörper (3) angesetztes, metallenes Gehäuse (7), wobei zwischen dem Kühlkörper (3) und dem Gehäuse (7) ein Hohlraum (9 mit einem Zulauf (12) und einem Ablauf (13) ausgebildet ist, in den die Kühlelemente (6) ragen, wobei die den Hohlraum (9) begrenzende Fläche (10) des Gehäuses (20) zumindest in dem Bereich, der den Kühlelementen (6) gegenüberliegt, mit einem nicht-metallischen Korrosionsschutzbelag (14) versehen ist.[English]
The invention relates to an electronics module, comprising an electronics unit (2) and a metal heat sink (3) having a plurality of protruding cooling elements (6), and comprising a metal housing (7) attached to the heat sink (3), wherein a cavity (9) having an inlet (12) and an outlet (13) is formed between the heat sink (3) and the housing (7), with the cooling elements (6) projecting into said cavity, wherein that surface (10) of the housing (20) that delimits the cavity (9) is provided with a non-metallic anti-corrosion coating (14) at least in the region opposite the cooling elements (6).[French]
L'invention concerne un module électronique, comprenant une unité électronique (2) et un dissipateur thermique métallique (3) ayant une pluralité d'éléments de refroidissement en saillie (6), et comprenant un boîtier métallique (7) fixé au dissipateur thermique (3). Une cavité (9) ayant une entrée (12) et une sortie (13) est formée entre le dissipateur thermique (3) et le boîtier (7), les éléments de refroidissement (6) faisant saillie dans ladite cavité, et la surface (10) du boîtier (20) qui délimite la cavité (9) est pourvue d'un revêtement anticorrosion non métallique (14) au moins dans la région en regard des éléments de refroidissement (6).