WO2026118394 - IMPRINTED CAVITY WITH PHOSPHOR FOR MICRO LED CHIPS
National phase entry is expected:
Publication Number
WO/2026/118394
Publication Date
11.06.2026
International Application No.
PCT/CN2025/096892
International Filing Date
23.05.2025
Title **
[English]
IMPRINTED CAVITY WITH PHOSPHOR FOR MICRO LED CHIPS
[French]
CAVITÉ FORMÉE PAR EMPREINTE AVEC LUMINOPHORE POUR PUCES MICRO-DEL
Applicants **
JADE BIRD DISPLAY (SHANGHAI) LIMITED
Inventors
WANG, Xiaolin
Priority Data
PCT/CN2024/136161
02.12.2024
CN
Application details
| Total Number of Claims/PCT | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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International Searching Authority |
CNIPA
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2597 | |
| EPO | Filing, Examination, Granting | 25056 | |
| Japan | Filing, Examination, Granting | 2955 | |
| South Korea | Filing, Examination, Granting | 3748 | |
| USA | Filing, Examination, Granting | 8740 |
Total:
43,096
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Abstract[English]
A micro LED chip is provided. The micro LED chip may include an IC backplane; a micro LED array, each micro LED of the micro LED array being separately electrically controlled by the IC backplane; and a patterned phosphor converter layer on top of the micro LED array. The patterned phosphor converter layer may be formed by applying a stamp on phosphor mixture applied on top of the micro LED array.[French]
L'invention concerne une puce micro-DEL. La puce micro-DEL peut comprendre un fond de panier de circuit intégré (IC) ; un réseau de micro-DEL, chaque micro-DEL du réseau de micro-DEL étant électriquement commandée séparément par le fond de panier IC ; et une couche de conversion par luminophore à motifs au-dessus du réseau de micro-DEL. La couche de conversion par luminophore à motifs peut être formée par application d'un moule d'empreinte sur un mélange de luminophores appliqué au-dessus du réseau de micro-DEL.