WO2026097834 - MICRO LED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

National phase entry is expected:
Publication Number WO/2026/097834
Publication Date 15.05.2026
International Application No. PCT/CN2025/096886
International Filing Date 23.05.2025
Title **
[English] MICRO LED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
[French] PANNEAU D'AFFICHAGE MICRO-LED, SON PROCÉDÉ DE FABRICATION ET DISPOSITIF D'AFFICHAGE
Applicants **
JADE BIRD DISPLAY (SHANGHAI) LIMITED
Inventors
CHEN, Peng
Priority Data
PCT/CN2024/130435   07.11.2024   CN
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Translation

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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2298
EPO Filing, Examination, Granting21884
Japan Filing, Examination, Granting2793
South Korea Filing, Examination, Granting3421
USA Filing, Examination, Granting7740
MasterCard Visa
Total: 38,136
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Abstract[English] A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a substrate layer disposed around the micro LED chip; a flexible circuit board (FCB) disposed on the substrate layer and adjacent to the micro LED chip and configured to couple to the micro LED chip; and a molded layer disposed on the micro LED chip, the substrate layer, and the FCB to join the micro LED chip and the FCB together, leaving an open region above the micro LED array.[French] L'invention concerne un élément micro-LED, un panneau d'affichage micro-LED et un dispositif d'affichage. Le panneau d'affichage micro-LED comprend une puce micro-LED comprenant une couche de commande et un réseau de micro-LED disposé sur la couche de commande, la couche de commande étant configurée pour recevoir des signaux permettant de commander le réseau de micro-LED ; une couche de substrat disposée autour de la puce micro-LED ; une carte de circuit imprimé souple (FCB) disposée sur la couche de substrat et adjacente à la puce micro-LED et configurée pour se coupler à la puce micro-LED ; et une couche moulée disposée sur la puce micro-LED, la couche de substrat, et la FCB pour relier la puce micro-LED et la FCB ensemble, laissant une région ouverte au-dessus du réseau de micro-LED.

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