WO2026097829 - MICRO LED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

National phase entry is expected:
Publication Number WO/2026/097829
Publication Date 15.05.2026
International Application No. PCT/CN2025/096880
International Filing Date 23.05.2025
Title **
[English] MICRO LED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
[French] ÉCRAN D'AFFICHAGE À MICRO-DEL, SON PROCÉDÉ DE FABRICATION ET DISPOSITIF D'AFFICHAGE
Applicants **
JADE BIRD DISPLAY (SHANGHAI) LIMITED
Inventors
CHEN, Peng
Priority Data
PCT/CN2024/130432   07.11.2024   CN
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Translation

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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2438
EPO Filing, Examination, Granting24250
Japan Filing, Examination, Granting2956
South Korea Filing, Examination, Granting3633
USA Filing, Examination, Granting8540
MasterCard Visa
Total: 41,817
Abstract[English] A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a substrate layer disposed on a back surface of the driving layer, the substrate layer including a reception structure not covered by the micro LED chip; and a molded layer disposed on the micro LED chip and the substrate layer, and disposed into the reception structure to collaboratively enclose a periphery of the micro LED chip with the substrate layer, leaving an open region above the micro LED array.[French] L'invention concerne un élément micro-DEL, un écran d'affichage à micro-DEL et un dispositif d'affichage. L'écran d'affichage à micro-DEL comprend : une puce à micro-DEL comportant une couche de pilotage et un réseau de micro-DEL disposé sur la couche de pilotage, la couche de pilotage étant conçue pour recevoir des signaux destinés à piloter le réseau de micro-DEL ; une couche de substrat disposée sur une face arrière de la couche de pilotage, la couche de substrat comportant une structure de réception non recouverte par la puce à micro-DEL ; et une couche moulée disposée sur la puce à micro-DEL et la couche de substrat, et introduite dans la structure de réception afin d'enfermer conjointement avec la couche de substrat la périphérie de la puce à micro-DEL, en laissant une zone ouverte au-dessus du réseau de micro-DEL.

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