WO2026045203 - PACKAGING STRUCTURE AND PACKAGED DEVICE
National phase entry:
Publication Number
WO/2026/045203
Publication Date
05.03.2026
International Application No.
PCT/CN2025/080724
International Filing Date
05.03.2025
Title **
[English]
PACKAGING STRUCTURE AND PACKAGED DEVICE
[French]
STRUCTURE D'EMBALLAGE ET DISPOSITIF EMBALLÉ
[Chinese]
封装结构、封装器件
Applicants **
CXMT CORPORATION
Inventors
WANG, Hailin
Priority Data
202411183523.4
26.08.2024
CN
Application details
| Total Number of Claims/PCT | * |
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International Searching Authority |
CNIPA
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1887 | |
| EPO | Filing, Examination, Granting | 14693 | |
| Japan | Filing, Examination, Granting | 2359 | |
| South Korea | Filing, Examination, Granting | 2490 | |
| USA | Filing, Examination, Granting | 4940 |
Total:
26,369
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Abstract[English]
A packaging structure and a packaged device. The packaging structure comprises: a dielectric layer; a first redistribution layer located in the dielectric layer; a second redistribution layer located on the first redistribution layer, the first redistribution layer being electrically connected to the second redistribution layer, and the top of the second redistribution layer protruding beyond the dielectric layer; a chip located on the dielectric layer; and a bond wire connecting the chip and the second redistribution layer. The thickness of the packaging structure is small.[French]
L'invention concerne une structure d'emballage et un dispositif emballé. La structure d'encapsulation comprend : une couche diélectrique ; une première couche de redistribution située dans la couche diélectrique ; une seconde couche de redistribution située sur la première couche de redistribution, la première couche de redistribution étant électriquement connectée à la seconde couche de redistribution, et la partie supérieure de la seconde couche de redistribution faisant saillie au-delà de la couche diélectrique ; une puce située sur la couche diélectrique ; et un fil de liaison connectant la puce et la seconde couche de redistribution. L'épaisseur de la structure d'encapsulation est faible.[Chinese]
一种封装结构和封装器件。封装结构包括：介质层；第一重布线层，位于所述介质层中；第二重布线层，位于所述第一重布线层上，所述第一重布线层与所述第二重布线层电连接，所述第二重布线层的顶部突出于所述介质层；芯片，位于所述介质层上；引线，连接所述芯片和所述第二重布线层。该封装结构的厚度小。