WO2025020771 - POWER APPARATUS AND ELECTRONIC SPEED CONTROL MODULE THEREOF
National phase entry:
Publication Number
WO/2025/020771
Publication Date
30.01.2025
International Application No.
PCT/CN2024/099700
International Filing Date
18.06.2024
Title **
[English]
POWER APPARATUS AND ELECTRONIC SPEED CONTROL MODULE THEREOF
[French]
APPAREIL D'ALIMENTATION ET MODULE DE COMMANDE DE VITESSE ÉLECTRONIQUE ASSOCIÉ
[Chinese]
动力装置及其电调模块
Applicants **
AUTOFLIGHT (KUNSHAN) CO., LTD.
Inventors
TIAN, Yu
CAO, Yifei
Priority Data
202310934744.X
27.07.2023
CN
202410652588.2
24.05.2024
CN
Application details
| Total Number of Claims/PCT | * |
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| Number of Multi-Dependent Claims | * |
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International Searching Authority |
CNIPA
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1629 | |
| EPO | Filing, Examination, Granting | 11611 | |
| Japan | Filing, Examination, Granting | 2014 | |
| South Korea | Filing, Examination, Granting | 1821 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
21,815
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The present application relates to the technical field of power. Disclosed are a power apparatus and an electronic speed control module thereof. The electronic speed control module in the present application comprises a PCB; several transistors, which are arranged spaced apart along an edge of the PCB; and a module housing, which is sleeved outside the PCB, wherein the side of each transistor that faces the module housing is connected to a ceramic substrate, and heat conduction is formed between the ceramic substrate and an inner wall of the module housing and is used for conducting out the heat generated by the transistors. In the present application, the heat generated by a power device is transferred out of a housing by using a ceramic substrate, such that the efficiency of heat dissipation is high, and the power device is also insulated from the housing.[French]
La présente demande se rapporte au domaine technique de l'alimentation. Sont divulgués un appareil d'alimentation et un module de commande de vitesse électronique associé. Le module de commande de vitesse électronique de la présente demande comprend une PCB ; plusieurs transistors, qui sont espacés le long d'un bord de la PCB ; et un boîtier de module, qui est enveloppé à l'extérieur de la PCB, le côté de chaque transistor qui fait face au boîtier de module étant connecté à un substrat en céramique, et une conduction thermique étant formée entre le substrat en céramique et une paroi interne du boîtier de module et utilisée pour évacuer la chaleur générée par les transistors. Dans la présente demande, la chaleur générée par un dispositif d'alimentation est transférée hors d'un boîtier à l'aide d'un substrat en céramique, de telle sorte que l'efficacité de la dissipation de chaleur est élevée, et le dispositif d'alimentation est également isolé du boîtier.[Chinese]
本申请涉及动力技术领域，公开了一种动力装置及其电调模块。本申请电调模块包括PCB板；若干晶体管，晶体管沿PCB板边缘间隔设置；模块外壳，模块外壳套设于PCB板外，其中晶体管朝向模块外壳一侧连接陶瓷基板，陶瓷基板与模块外壳的内壁形成热传导，用于将晶体管产生的热量导出。本申请利用陶瓷基板将功率器件产生的热量传递到外壳外，散热效率较高，同时对功率器件和外壳进行了绝缘。