WO2024113228 - CIRCUIT DEVICE AND DISPLAY APPARATUS
National phase entry:
Publication Number
WO/2024/113228
Publication Date
06.06.2024
International Application No.
PCT/CN2022/135458
International Filing Date
30.11.2022
Title **
[English]
CIRCUIT DEVICE AND DISPLAY APPARATUS
[French]
DISPOSITIF DE CIRCUIT ET APPAREIL D'AFFICHAGE
Applicants **
BOE TECHNOLOGY GROUP CO., LTD.
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Inventors
LI, Dehui
QIAN, Zhengkun
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
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International Searching Authority |
CNIPA
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1885 | |
| EPO | Filing, Examination, Granting | 14500 | |
| Japan | Filing, Examination, Granting | 2315 | |
| South Korea | Filing, Examination, Granting | 2356 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
25,796
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A circuit device is provided. The circuit device includes a flexible printed circuit portion(FPCP) and an antenna portion(ATP). The circuit device includes a base substrate(BS) having a unitary structure extending from a region of the antenna portion(ATP) to a region of the flexible printed circuit portion(FPCP); and a first conductive layer(CDL1) on a first side(S1) of the base substrate(BS). The first conductive layer(CDL1) includes one or more coil lines(COL) in the antenna portion(ATP) and one or more first conductive lines(CL1) in the flexible printed circuit portion(FPCP). [French]
L'invention concerne un dispositif de circuit. Le dispositif de circuit comprend une partie de circuit imprimé souple (FPCP) et une partie d'antenne (ATP). Le dispositif de circuit comprend un substrat de base (BS) ayant une structure unitaire qui s'étend d'une région de la partie d'antenne (ATP) jusqu'à une région de la partie de circuit imprimé souple (FPCP) ; et une première couche conductrice (CDL1) située sur un premier côté (S1) du substrat de base (BS). La première couche conductrice (CDL1) comprend une ou plusieurs lignes de bobine (COL) dans la partie d'antenne (ATP) et une ou plusieurs premières lignes conductrices (CL1) dans la partie de circuit imprimé souple (FPCP).