WO2023123484 - MICRO LEDPACKAGE STRUCTURE AND MICRO LED OPTICAL MODULE
National phase entry is expected:
Publication Number
WO/2023/123484
Publication Date
06.07.2023
International Application No.
PCT/CN2021/143985
International Filing Date
31.12.2021
Title **
[English]
MICRO LEDPACKAGE STRUCTURE AND MICRO LED OPTICAL MODULE
[French]
STRUCTURE DE BOÎTIER DE MICRO-DEL ET MODULE OPTIQUE À MICRO-DEL
Applicants **
JADE BIRD DISPLAY (SHANGHAI) COMPANY
Inventors
ZHANG, Shuai
XU, Huiwen
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
CNIPA
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2171 | |
| EPO | Filing, Examination, Granting | 15619 | |
| Japan | Filing, Examination, Granting | 2450 | |
| South Korea | Filing, Examination, Granting | 2645 | |
| USA | Filing, Examination, Granting | 5140 |
Total:
28,025
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A micro LED package structure and a micro LED optical module are disclosed. The micro LED package structure comprises: a main circuit board (1101), several circuit branches (1102, 1103, 1104) and several micro LED panels (201, 202, 203). The main circuit board (1101) comprises a printed circuit for controlling the micro LED panels (201, 202, 203); the circuit branches (1102, 1103, 1104) are separately connected with the main circuit board (1101); and, the micro LED panels (201, 202, 203) are separately configured onto the end surfaces of the circuit branches (1102, 1103, 1104). The above solution simplifies the package structure of the micro LED, controls the chief ray angle of the micro LED structure, reduces the loss of the light emitting from the sidewall of the mesa, and further decreases the volume and the weight of the micro LED optical module.[French]
L'Invention concerne une structure de boîtier de micro-DEL et un module optique à micro-DEL. La structure de boîtier de micro-DEL comprend une carte de circuit principale (1101), plusieurs branches de circuit (1102, 1103, 1104) et plusieurs panneaux de micro-DEL (201, 202, 203). La carte de circuit imprimé principale (1101) comprend un circuit imprimé servant à commander les panneaux de micro-DEL (201, 202, 203) ; les branches de circuit (1102, 1103, 1104) sont séparément connectées à la carte de circuit principale (1101) ; et les panneaux de micro-DEL (201, 202, 203) sont séparément disposés sur les surfaces d'extrémité des branches de circuit (1102, 1103, 1104). La solution ci-dessus simplifie la structure de boîtier des micro-DEL, contrôle l'angle de rayon principal de la structure de micro-DEL, réduit la perte de lumière provenant de la paroi latérale du mesa, et réduit en outre le volume et le poids du module optique à micro-DEL.